• Support Qualcomm Snapdragon/Dimensity/Hisilicon Kirin/Exynos/BGA/Android and other series. Applicable to ACU/EMMC/EXC/HIC/MTC/SMC series, etc.
• Use mobile phones for actual measurement to ensure accuracy. Each mesh is calibrated according tothe mobile phone drawings to ensure that every solder joint is indispensable
• It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips
• UItra thin design, better fit of tin planting, continuous bending and full toughness

Specifications:

• Product: Android series chip planting tin steel stencil set
• Model: RL-044
• Net weight: about 130g
• Size: 50 * 50 * 0.12/0.15mm
• Thickness: 0.12 /0.15mm (EMMC series)
• Quantity: 58pcs/box